何大平课题组                                                                                                                                                                                    武汉理工大学
        肖勇, 1985年出生,湖北嘉鱼人,博士,副教授,硕士生导师。于2014年获得哈尔滨工业大学材料加工工程专业博士学位,同年加入武汉理工大学材料学院从事教学科研工作。作为负责人主持了国家自然科学基金、湖北省自然科学基金、企事业单位委托项目等共16项课题,同时参与各类纵、横向课题多项。目前已在Ultrasonics sonochemistry, Materials Science and Engineering A, Materials & Design等国际知名期刊发表SCI论文15篇,申请国家发明专利15项(已授权8项)。主要研究方向碳材料、有色金属、陶瓷材料的低温连接工艺及材料。

联系邮箱: yongxiao@whut.edu.cn


近年来主持或参与的科研项目情况:

[1] 超声辅助泡沫Ni/Sn复合焊料低温钎焊超细晶Al合金接头连接机理研究,国家自然科学基金(青年基金),2017-2019,20万,主持;

[2] 铝合金中温钎剂制备及钎焊工艺研究,中国电器科学研究院,9.9万,2018-2019,主持;

[3] 紫铜管钎焊设备项目,军工横向, 2018-2019,18.9万,主持;

[4] 可增加声波钎焊作用效果的软钎料研究,军工横向, 2018-2019,15.9万,主持。


发表论文:

[1] Yong Xiao, Qiwei Wang, Ziqi Wang, Xian Zeng*, Mingyu Li, Ling Wang, Xiaomeng Zhu. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer, Ultrasonics Sonochemistry, 2018, 45: 223-230. (SCI, IF=6.012, 中科院一区)

[2] Xingyi Zhang, Yong Xiao*, Ling Wang, Chao Wan, Qiwei Wang, Hongchao Sheng, Mingyu Li. Ultrasound-induced liquid/solid interfacial reaction between Zn-3Al alloy and Zr-based bulk metallic glasses, Ultrasonics Sonochemistry, 2018, 45: 86-94. (SCI, IF=6.012, 中科院一区)

[3] Ming Yang, Sang Woo Kim, Shuye Zhang, Dae Young Park, Chang-Woo Lee, Yong-Ho Ko*, Haifeng Yang, Yong Xiao*, Gang Chen and Mingyu Li. Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties. Journal of Materials Chemistry C, 2018, Accepted Manuscript. (SCI, IF=5.976, 中科院一区)

[4] Yong Xiao*, Shan Li, Ziqi Wang, Yong Xiao*, Zhipeng Song, Yongning Mao, Mingyu Li. Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder. Materials Science and Engineering A, 2018, 729: 241-248.

[5] Dan Luo, Yong Xiao*, Ling Wang, Li Liu, Xian Zeng, Mingyu Li. Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves, Ceramics International, 2017, 43(10): 7531-7536. (SCI, IF=3.057, 中科院一区)

[6] Yong Xiao, Yuanqi Zhang, Kai Zhao, Shan Li, Ling Wang, Jue Xiao, Li Liu*, Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders, Ceramics International, 2017, 43(16): 14314-14320. (SCI, IF=3.057, 中科院一区)

[7] Yong Xiao, Mingyu Li*, Ling Wang, Shangyu Huang, Xueming Du, Zhiquan Liu*. Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn-Al/Cu joints. Materials & Design, 2015,73:42-49.

[8] Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-induced equiaxial flower-like CuZn5/Al composite microstructure formation in Al/Zn-Al/Cu joint. Materials Science and Engineering A, 2014, 594:135-139.

[9] Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim, Hongbae Kim. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn-Al hypereutectic filler metal. Materials & Design, 2013, 47:717–724.

[10] Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design, 2013, 52:740-747.

 

 

联系地址:武汉理工大学南湖校区物理楼 邮箱: